Method of manufacturing circuit forming board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S831000, C029S846000, C156S230000

Reexamination Certificate

active

08069557

ABSTRACT:
In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows a connecting member, such as conductive paste, to electrically couple between layers of the circuit forming board.

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patent: 2000-174438 (2000-06-01), None
European Search Report issued Oct. 12, 2009 in European Patent Application No. 04 73 3120, which is a foreign counterpart of the present application.

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