Determining process condition in substrate processing module

Details Determining process condition in substrate processing module Determining process condition in substrate processing module

2008-04-21

2011-10-25

Wachsman, Hal (Department: 2857)

Data processing: measuring, calibrating, or testing

Measurement system

Performance or efficiency evaluation

C702S182000, C702S084000

Reexamination Certificate

active

08046193

ABSTRACT:
A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for a more simplified configuration.

REFERENCES:
patent: 3504164 (1970-03-01), Farrell et al.
patent: 3518416 (1970-06-01), Gebel et al.
patent: RE32369 (1987-03-01), Stockton et al.
patent: 5262944 (1993-11-01), Weisner et al.
patent: 5435646 (1995-07-01), McArthur et al.
patent: 5444637 (1995-08-01), Smesny et al.
patent: 5564889 (1996-10-01), Araki
patent: 5893796 (1999-04-01), Birang et al.
patent: 5961597 (1999-10-01), Sapir et al.
patent: 5969639 (1999-10-01), Lauf et al.
patent: 5970313 (1999-10-01), Rowland et al.
patent: 5978753 (1999-11-01), Eidson
patent: 6010538 (2000-01-01), Sun et al.
patent: 6033922 (2000-03-01), Rowland et al.
patent: 6075909 (2000-06-01), Ressl
patent: 6100506 (2000-08-01), Colelli, Jr. et al.
patent: 6125420 (2000-09-01), Eidson
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6173240 (2001-01-01), Sepulveda et al.
patent: 6190040 (2001-02-01), Renken et al.
patent: 6280289 (2001-08-01), Wiswesser et al.
patent: 6309276 (2001-10-01), Tsai et al.
patent: 6313903 (2001-11-01), Ogata
patent: 6325536 (2001-12-01), Renken et al.
patent: 6377130 (2002-04-01), Haman
patent: 6378378 (2002-04-01), Fisher
patent: 6413867 (2002-07-01), Sarfaty et al.
patent: 6442445 (2002-08-01), Bunkofske et al.
patent: 6472240 (2002-10-01), Akram et al.
patent: 6510395 (2003-01-01), Stanke
patent: 6542835 (2003-04-01), Mundt
patent: 6553277 (2003-04-01), Yagisawa et al.
patent: 6594589 (2003-07-01), Coss, Jr. et al.
patent: 6675137 (2004-01-01), Toprac et al.
patent: 6691068 (2004-02-01), Freed et al.
patent: 6725402 (2004-04-01), Coss, Jr. et al.
patent: 6748280 (2004-06-01), Zou et al.
patent: 6790763 (2004-09-01), Kondo et al.
patent: 6812717 (2004-11-01), Borden et al.
patent: 6828225 (2004-12-01), Kondo et al.
patent: 6842025 (2005-01-01), Gershenzon et al.
patent: 6862484 (2005-03-01), Hayashi
patent: 6916147 (2005-07-01), Suh et al.
patent: 6982953 (2006-01-01), Swales
patent: 7151366 (2006-12-01), Renken et al.
patent: 2001/0014520 (2001-08-01), Usui et al.
patent: 2002/0061758 (2002-05-01), Zarlengo et al.
patent: 2002/0078770 (2002-06-01), Hunter
patent: 2002/0109590 (2002-08-01), Parsons
patent: 2002/0148307 (2002-10-01), Jonkers
patent: 2002/0161557 (2002-10-01), Freed
patent: 2002/0167326 (2002-11-01), Borden et al.
patent: 2002/0172097 (2002-11-01), Freed
patent: 2002/0177916 (2002-11-01), Poolla et al.
patent: 2002/0177917 (2002-11-01), Polla et al.
patent: 2002/0186662 (2002-12-01), Tomassetti et al.
patent: 2002/0193957 (2002-12-01), Freed
patent: 2003/0209097 (2003-11-01), Hunter
patent: 2003/0223057 (2003-12-01), Ramsey et al.
patent: 2004/0078463 (2004-04-01), Pearlman et al.
patent: 2004/0107066 (2004-06-01), Poolla et al.
patent: 2004/0131226 (2004-07-01), Poolla
patent: 2004/0225462 (2004-11-01), Renken et al.
patent: 2004/0249604 (2004-12-01), Poolla et al.
patent: 2004/0267501 (2004-12-01), Freed et al.
patent: 1014437 (2000-06-01), None
patent: 1014437 (2000-06-01), None
patent: 07-282146 (1995-10-01), None
patent: 11-016798 (1999-01-01), None
patent: WO 00/68986 (2000-11-01), None
patent: WO 02/17030 (2002-02-01), None
patent: WO 03/067183 (2003-08-01), None
patent: WO 03/067183 (2003-08-01), None
patent: WO 03/103024 (2003-12-01), None
patent: WO 2004/051713 (2004-06-01), None
U.S. Appl. No. 60/354,551, filed Feb. 6, 2003, to Ramsey et al., entitled “Wafer-Like Sensor”.
U.S. Appl. No. 60/525,710, filed Nov. 29, 2003, to Mundt et al., entitled “Sensor Apparatus Automated Management Methods and Apparatus”.
U.S. Appl. No. 60/285,613, filed Apr. 19, 2001, to Freed et al.; entitled “Firmware, Methods, Apparatus, and Computer Program Products for Wafer Sensors”.
U.S. Appl. No. 60/285,439, filed Apr. 19, 2001, to Freed et al.; entitled “Methods Apparatus, and Computer Program Products for Obtaining Data for Process Operation, Optimization, Monitoring, and Control”.
Freed et al.; “Autonomous On-Wafer Sensors for Process Modeling, Diagnosis, and Control”, IEEE Transactions on Semiconductor Manufacturing, vol. 14, No. 3, Aug. 2001, pp. 255-264.
Freed; “Wafer-Mounted Sensor Arrays for Plasma Etch Processes”, Dissertation, Univ. of CA. Berkeley, Fall 2001.
Baker et al.; “A Novel in Situ Monitoring Technique for Reactive Ion Etching Using a Surface Micromachined Sensor,” IEEE Transactions on Semiconductor Manufacturing, vol. 11, No, 2, May 1998, pp. 254-264.
U.S. Appl. No. 60/411,857, filed Sep. 18, 2002, to Poolla, entitled “Methods and Apparatus for Equipment matching and Characterization”.
Schneider Electric, “In-Situ particle Monitor (ISPM) Improves Wafer Yield for Semiconductor Customer: Advanced Process Control Utilizing Reliable, Off-the-Shelf Components Creates Rapid ROI”, brochure, Mar. 2002, 6 pages.
Brooks Automation “SMC-Patterns Option for Brooks-Sentinel TM”, brochure, 2001, 2 pages.
Brooks Automation, “Patterns TM Software”, Brochure, 2000, 6pages.
Semiconductor International, “Fault Detection: Problem Solving From the Process Perspective”, Feb. 2001, vol. 24 No. 2, 6pages.
O'Sullivan, Paul J. et al., “Using UPM for Real-Time Multivariate Modeling of Semiconductor Manufacturing Equipment” dated Nov. 1995, http://www.triant.com/content-techpapers.html, 15 pages.
Triant Technologies, Inc. “Data Flow”, http:// www.triant.com/works.html, downloaded Jun. 10, 2004, 5 pages.
Triant Technologies, Inc. “Universal Process Modeling”, http:// www.triant.com/works.html, downloaded Jun. 10, 2004, 4 pages.
Triant Technologies, Inc. “Model Ware/RT Improves Overall Equipment Efficiency”, http://www.triant.com/works.html, downloaded Jun. 10, 2004, 4 pages.
Brooks Automation, “Cornerstone Distribution Fitting and Process Capability”, http://brooks.com/pages/1228—cornerstone—distribution—fitting—and—process—capability, downloaded Jun. 10, 2004, 2 pages.
SiAutomation, “Fault Detection & Classification: Maestria”, http://www.siautomation.com/ prod—gpack.htm, downloaded Jun. 10, 2004, 2 pages.
Olszewski, Robert T., “Generalized Feature Extraction for Structural Pattern Recognition in Time-Series Data”, School of Computer Science, Carnegie Mellon University, Thesis, 2001, 122 pages.
Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or Declaration, in corresponding PCT/US2005/023959, dated Feb. 3, 2006, 15 pages.
Office Action dated Nov. 13, 2006 for U.S. Appl. No. 11/174,022.
Final Office Action dated May 10, 2007 for U.S. Appl. No. 11/174,022.
Notice of Allowance dated Dec. 21, 2007 for U.S. Appl. No. 11/174,022.

Affiliated with

Also associated with

Rating

Determining process condition in substrate processing module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Determining process condition in substrate processing module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Determining process condition in substrate processing module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4300994