Mitigating heat in an integrated circuit

Refrigeration – Using electrical or magnetic effect – Thermoelectric; e.g. – peltier effect

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C062S259200

Reexamination Certificate

active

08028531

ABSTRACT:
The present invention provides for a system and method for regulating and monitoring heat dissipation of an integrated circuit by employing a heat regulating device with a thermal structure net work assembly. Each thermal structure can act as a heat conducting pathway for inducing heat into and/or dissipating heat away from the integrated circuit, thus creating a more uniform temperature gradient across the semiconductor body.

REFERENCES:
patent: 4278914 (1981-07-01), Harper
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5636234 (1997-06-01), Takagi
patent: 5740016 (1998-04-01), Dhindsa
patent: 5867990 (1999-02-01), Ghoshal
patent: 5940784 (1999-08-01), El-Husayni
patent: 5943553 (1999-08-01), Spaeth
patent: 6098408 (2000-08-01), Levinson et al.
patent: 6105381 (2000-08-01), Ghoshal
patent: 6128188 (2000-10-01), Hanners
patent: 6230497 (2001-05-01), Morris et al.
patent: 6573596 (2003-06-01), Saika
patent: 6588217 (2003-07-01), Ghoshal
patent: 6614109 (2003-09-01), Cordes et al.
patent: 6727422 (2004-04-01), Macris
patent: 6729383 (2004-05-01), Cannell et al.
patent: 6739138 (2004-05-01), Saunders et al.
patent: 6787691 (2004-09-01), Fleurial et al.
patent: 6804966 (2004-10-01), Chu et al.
patent: 6882543 (2005-04-01), Kenny et al.
patent: 6893902 (2005-05-01), Cordes et al.
patent: 6918178 (2005-07-01), Chao et al.
patent: 6952050 (2005-10-01), Kwon
patent: 7164077 (2007-01-01), Venkatasubramanian
patent: 7231772 (2007-06-01), Bell
patent: 2003/0097845 (2003-05-01), Saunders et al.
patent: 2005/0086948 (2005-04-01), Mike-Rojo et al.
patent: 2006/0054091 (2006-03-01), Speciale et al.
patent: 9206561 (1992-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mitigating heat in an integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mitigating heat in an integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mitigating heat in an integrated circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4300573

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.