Electronic system and heat dissipation device thereof

Details Electronic system and heat dissipation device thereof Electronic system and heat dissipation device thereof

2010-04-30

2011-12-27

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S704000, C361S719000, C174S015100, C174S015200, C165S080400, C165S104260

Reexamination Certificate

active

08085539

ABSTRACT:
A heat dissipation device for an electronic component mounted on a circuit board includes a heat pipe and a fastening assembly. The heat pipe includes an evaporation section and a condensation section. The fastening assembly includes a retention plate and a wire clip. The retention plate includes a retaining portion abutting against the heat pipe, and two fastening portions located at opposite sides of the evaporation section of the heat pipe. The wire clip includes two abutting portions, a resisting portion interconnecting the abutting portions, and two locking arms extending outwardly from two outer ends of the abutting portions, respectively. The retaining portion and the resisting portion abut against the evaporation section of the heat pipe, the abutting portions abut against inner surfaces of the fastening portions, the locking arms are fastened to the circuit board, thereby mounting the retention plate with the heat pipe on the electronic component.

REFERENCES:
patent: 7414850 (2008-08-01), Hung
patent: 2008/0105410 (2008-05-01), Hwang et al.
patent: 2009/0032219 (2009-02-01), Hung et al.

Affiliated with

Also associated with

Rating

Electronic system and heat dissipation device thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic system and heat dissipation device thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic system and heat dissipation device thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4299391