Method of manufacturing wiring substrate and method of...

Details Method of manufacturing wiring substrate and method of... Method of manufacturing wiring substrate and method of...

2009-03-24

2011-12-20

Tucker, Philip (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S293000, C156S305000

Reexamination Certificate

active

08080122

ABSTRACT:
There are provided a step of preparing a dummy chip, a step of forming a cavity in a stiffener substrate, a step of providing a second tape base member on one surface of the stiffener substrate, a step of inserting the dummy chip into the cavity to provide the dummy chip on the second tape base member, a step of sealing the stiffener substrate and the dummy chip with a sealing resin, a step of removing the second tape base member and forming a build-up wiring layer on a surface from which the second tape base member is removed, a step of removing the sealing resin; and a step of peeling the dummy chip from the build-up wiring layer.

REFERENCES:
patent: 5960536 (1999-10-01), Ogino et al.
patent: 6220499 (2001-04-01), Brofman et al.
patent: 7145247 (2006-12-01), Kawano et al.
patent: 2003/0227095 (2003-12-01), Fujisawa et al.
patent: 2008/0280399 (2008-11-01), Burrell et al.
patent: 2009/0236031 (2009-09-01), Sunohara et al.
patent: 2002-170840 (2002-06-01), None
patent: 2002170840 (2002-06-01), None

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