Substrate measuring method, computer-readable recording...

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Quality evaluation

Reexamination Certificate

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Reexamination Certificate

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08041525

ABSTRACT:
In the present invention, for measurement of line widths, for example, at 36 locations within a substrate processed in a coating and developing treatment system, the 36 measurement points are divided and, for example, six substrates are used to measure the line widths at all of measurement points. In this event, the line widths at six measurement points are measured in each of the substrate, which exist in substrate regions different for each substrate. Then, the measurement results of the line widths at the measurement points of the substrates are combined, so that the line widths at 36 measurement points are finally detected. According to the present invention, the measurements of product substrates can be performed without decreasing the throughput of processing of the product substrates.

REFERENCES:
patent: 6392434 (2002-05-01), Chiu
patent: 2004/0097063 (2004-05-01), Sakuma et al.
patent: 2003-209093 (2003-07-01), None
patent: 2006-128572 (2006-05-01), None
patent: WO 2006/085527 (2006-08-01), None
patent: WO 2006/087938 (2006-08-01), None
patent: WO 2006/087955 (2006-08-01), None
Tadao Takeda, Methodology of Process Evaluation with Wafer-mapping Techniques for Statistical Process Control, Proc. IEEE 1994 Int. Conference on Microelectronic Test Structures, vol. 7, Mar. 1994, p. 85-89.

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