Electronic device

Details Electronic device Electronic device

2010-05-25

2011-10-04

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S104330, C361S694000, C361S695000

Reexamination Certificate

active

08031469

ABSTRACT:
According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.

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Notice of Reasons for Rejection mailed by Japan Patent Office on Aug. 3, 2010 in the corresponding Japanese patent application No. 2009-228133.
Notice of Reasons for Rejection mailed by Japan Patent Office on Oct. 26, 2010 in the corresponding Japanese patent application No. 2009-228133.
Information Sheet for preparing an Information Disclosure Statement under Rule 1.56.
Translation of Reference for JP U58-27895 A.

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