Mounting method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S358000, C156S060000, C156S308200, C156S580000, C156S381000, C156S382000

Reexamination Certificate

active

08048254

ABSTRACT:
A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained.

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European Office Action issued on Jan. 11, 2010 for corresponding European Patent Application 07708356.
Klaka et al., “Reduction of Thermomechanical Stress by applying a Low Temperature Joining Technique,” Proceedings of the International Symposium on Power Semiconductor Devices & IC's, Davos, Switzerland, May 31-Jun. 2, 1994, IEEE Cat. No. 94CH3377-9, pp. 259-264.

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