Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2008-08-20
2011-11-01
Tucker, Philip (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S358000, C156S060000, C156S308200, C156S580000, C156S381000, C156S382000
Reexamination Certificate
active
08048254
ABSTRACT:
A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained.
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K&L Gates LLP
Sony Chemical & Information Device Corporation
Tucker Philip
Wu Vicki
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