Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2010-04-21
2011-12-06
Wilson, Allan R (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21511, C438S118000
Reexamination Certificate
active
08071425
ABSTRACT:
The flip chip mounted body of the present invention includes: a circuit board (213) having a plurality of connection terminals (211); a semiconductor chip (206) having a plurality of electrode terminals (207) that are disposed opposing the connection terminals (211); and a porous sheet (205) having a box shape that is provided on an opposite side of a formation surface of the electrode terminal (207) of the semiconductor chip (206), is folded on an outer periphery of the semiconductor chip (206) on the formation surface side of the electrode terminal (207) and is in contact with the circuit board (213), wherein the connection terminal (211) of the circuit board (213) and the electrode terminal (207) of the semiconductor chip (206) are connected electrically via a solder layer (215), and the circuit board (213) and the semiconductor chip (206) are fixed by a resin (217). Thereby, the flip chip mounted body with excellent productivity and reliability that can mount the semiconductor chip on the circuit board, and a method and an apparatus for mounting the flip chip mounted body are provided.
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Sakamoto, I. et al., “Ultra fine pitch solder bump forming equipment compatible with lead-free solder”, Electronics Packing Technology, vol. 30, No. 12, 2004, pp. 34-35.
Ichiryu Takashi
Karashima Seiji
Kitae Takashi
Nakatani Seiichi
Yamashita Yoshihisa
Hamre Schumann Mueller & Larson P.C.
Panasonic Corporation
Wilson Allan R
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