Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate
2006-02-10
2011-12-13
MacArthur, Sylia R. (Department: 1716)
Semiconductor device manufacturing: process
Chemical etching
C438S667000, C438S674000
Reexamination Certificate
active
08076244
ABSTRACT:
A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.
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Van Zant, “Photolithography-Developing to Final Inspection”, Chapter Nine, pp. 226-233, Microchip Fabrication—A Practical Guide to Semiconductor Processing, Second Edition, 1990.
MacArthur Sylia R.
Micro)n Technology, Inc.
TraskBritt
LandOfFree
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