Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-10-24
2011-12-13
Feely, Michael J (Department: 1761)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S330000, C257S793000, C428S413000, C428S414000, C523S440000, C525S523000, C525S524000
Reexamination Certificate
active
08075721
ABSTRACT:
This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport. The inventive compositions possess an exotherm under 300 J/g and/or demonstrate package stability at 55° C. for 7 days and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.
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Chan Chew B.
Ji Qing
Shi Weitong
Yun Hwang K.
Zhao Renzhe
Bauman Steven C.
Feely Michael J
Henkel Corporation
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