Semiconductor encapsulating epoxy resin composition and...

Details Semiconductor encapsulating epoxy resin composition and... Semiconductor encapsulating epoxy resin composition and...

Filed on

2006-04-24

Date issued

2011-11-01

Examiner

Eashoo, Mark (Department: 1767)

Patent Class

Synthetic resins or natural rubbers -- part of the class 520 ser

SubClass

Synthetic resins

SubSubClass

Mixing of two or more solid polymers; mixing of solid...

Other Related Categories

C428S413000, C523S400000

Type

Reexamination Certificate

Status

active

Patent number

08048969

Description

ABSTRACT:
An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

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patent: 2003/0152777 (2003-08-01), Osada et al.
patent: 2004/0006168 (2004-01-01), Wagner et al.
patent: 3137202 (2000-12-01), None
patent: 2005-015689 (2005-01-01), None

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