Abrading – Abrading process – Utilizing nonrigid tool
Reexamination Certificate
2004-09-01
2011-12-13
Eley, Timothy V (Department: 3723)
Abrading
Abrading process
Utilizing nonrigid tool
C051S298000, C451S527000, C451S529000, C451S550000
Reexamination Certificate
active
08075372
ABSTRACT:
The invention provides a polishing pad for chemical-mechanical polishing comprising a polymeric material comprising two or more adjacent regions, wherein the regions have the same polymer formulation and the transition between the regions does not include a structurally distinct boundary. In a first embodiment, a first region and a second adjacent region have a first and second non-zero void volume, respectively, wherein the first void volume is less than the second void volume. In a second embodiment, a first non-porous region is adjacent to a second adjacent porous region, wherein the second region has an average pore size of about 50 μm or less. In a third embodiment, at least two of an optically transmissive region, a first porous region, and an optional second porous region, are adjacent. The invention further provides methods of polishing a substrate comprising the use of the polishing pads and a method of producing the polishing pads.
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Borg-Breen Caryn
Cabot Microelectronics Corporation
Eley Timothy V
Omholt Thomas E.
Weseman Steven D.
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