Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2009-01-16
2011-11-01
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C174S262000, C439S066000
Reexamination Certificate
active
08046912
ABSTRACT:
A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
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Haba Belgacem
Kang Teck-Gyu
Kubota Yoichi
Park Jae M.
Lerner David Littenberg Krumholz & Mentlik LLP
Nguyen Donghai D.
Tessera Inc.
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