Cooling of substrate using interposer channels

Details Cooling of substrate using interposer channels Cooling of substrate using interposer channels

2008-09-18

2011-11-15

Bui, Hung S (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000

Reexamination Certificate

active

08059400

ABSTRACT:
A method of forming a structure. An interposer is provided. The interposer is adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink.

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