Stackable integrated circuit package system with recess

Details Stackable integrated circuit package system with recess Stackable integrated circuit package system with recess

2006-12-30

2011-10-11

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S686000, C257S690000, C257S693000, C257S713000, C257S680000, C438S106000, C438S109000, C438S112000, C438S123000, C438S127000

Reexamination Certificate

active

08035207

ABSTRACT:
A stackable integrated circuit package system is provided including forming an external interconnect having an interconnect non-recessed portion and an interconnect recessed portion, mounting an integrated circuit die over a paddle that is coplanar with the interconnect recessed portion, and forming an encapsulation having a recess over the external interconnect and the integrated circuit die with the external interconnect exposed at a side of the encapsulation.

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