Semiconductor chip package and printed circuit board

Details Semiconductor chip package and printed circuit board Semiconductor chip package and printed circuit board

2008-09-05

2011-11-22

Semenenko, Yuriy (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S260000

Reexamination Certificate

active

08064215

ABSTRACT:
A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip.

REFERENCES:
patent: 6894396 (2005-05-01), Shioga et al.
patent: 6975516 (2005-12-01), Asahi et al.
patent: 7489032 (2009-02-01), Jobetto
patent: 2001/0010627 (2001-08-01), Akagawa
patent: 2007/0178412 (2007-08-01), Jung et al.
patent: 05267557 (1993-10-01), None
patent: 2004-79701 (2004-03-01), None
Korean Patent Office Action, mailed Sep. 30, 2008 and issued in corresponding Korean Patent Application No. 10-2007-0094916.

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