Substrate structures and methods for electronic circuits

Details Substrate structures and methods for electronic circuits Substrate structures and methods for electronic circuits

2009-03-17

2011-10-11

Nguyen, Khiem (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S763000

Reexamination Certificate

active

08035984

ABSTRACT:
Substrate structure embodiments generally have first and second sides and are configured to form at least one opening that communicates between the first and second sides. A circuit path is carried on the first side and extended over the opening wherein the circuit path has a near side facing the substrate and has a far side facing away from the substrate. A circuit element has at least one bonding pad and is inserted into the opening after which the conductive bump is arranged to join the pad to the path. In another embodiment, the bump joins the pad to the near side of the path. In another embodiment, the path defines a hole and the bump fills the hole. In yet another system embodiment, the opening comprises a recess and associated vias. These embodiments may also have a second conductive circuit path carried on the first side and having a near side facing the substrate and a far side facing away from the substrate. The systems may then include a second circuit element and at least one second conductive bump.

REFERENCES:
patent: 5453405 (1995-09-01), Fan et al.
patent: 6414382 (2002-07-01), Hashimoto
patent: 6458472 (2002-10-01), Konarski et al.
patent: 6593220 (2003-07-01), Yu et al.
patent: 6784020 (2004-08-01), Lee et al.
patent: 6791119 (2004-09-01), Slater et al.
patent: 6885035 (2005-04-01), Bhat et al.
patent: 6903376 (2005-06-01), Shen et al.
patent: 7026659 (2006-04-01), Slater et al.
patent: 7037742 (2006-05-01), Slater et al.
patent: 7119447 (2006-10-01), Larking
patent: 7897880 (2011-03-01), Goergen et al.
patent: 7916492 (2011-03-01), Zhong et al.

Affiliated with

Also associated with

Rating

Substrate structures and methods for electronic circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate structures and methods for electronic circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate structures and methods for electronic circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4291940