Electronic circuit arrangement

Details Electronic circuit arrangement Electronic circuit arrangement

2007-05-22

2011-10-18

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257SE23026

Reexamination Certificate

active

08039971

ABSTRACT:
Electronic circuit arrangement, includes a chip and a chip carrier having a substrate and a chip contact location. At least the chip contact location is provided with a soldering layer. The chip includes a bonding layer. A silver layer for eutectic bonding with the bonding layer is provided on the soldering layer in the region of the chip contact location.

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