Conductive ball arraying apparatus

Metal fusion bonding – With control means responsive to sensed condition

Reexamination Certificate

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Details

C414S288000, C414S293000, C414S289000, C228S041000

Reexamination Certificate

active

08042722

ABSTRACT:
A conductive ball arraying apparatus includes an arraying jig having ball insertion parts at a predetermined array pattern, a ball cup that has an opening part on a lower surface thereof and is capable of housing a plurality of conductive balls, moving means that moves the arraying jig and the ball cup relatively and moves the ball cup relatively along an upper surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig. The apparatus includes means for detecting a quantity of the conductive balls in the ball cup and detects as to whether the quantity of the conductive balls in the ball cup reaches at least one of an upper limit and a lower limit and/or means for detecting leakage of the conductive balls from a clearance between the ball cup and the arraying jig.

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