Method for stamping thermally activatable adhesive materials...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S257000, C156S264000, C156S268000, C156S270000, C156S248000, C156S308200

Reexamination Certificate

active

08062458

ABSTRACT:
Method for producing diecuts from heat-activatable adhesive films which comprises applying a layer of heat-activatable adhesive material to a carrier material having a glass transition temperature at least 20° C. lower that that of the adhesive, laminating the heat-activatable layer onto a release liner at a temperature between the glass transition temperature of the release liner and heat activatable adhesive and then diecutting the heat-activatable adhesive layer on the release liner.

REFERENCES:
patent: 3326741 (1967-06-01), Olson
patent: 3639500 (1972-02-01), Muny et al.
patent: 4404246 (1983-09-01), Charbonneau et al.
patent: 4404345 (1983-09-01), Janssen
patent: 4452955 (1984-06-01), Boeder
patent: 4545843 (1985-10-01), Bray
patent: 4880683 (1989-11-01), Stow
patent: 5491012 (1996-02-01), Lühmann et al.
patent: 5593759 (1997-01-01), Vargas et al.
patent: 6531024 (2003-03-01), Braun
patent: 2006/0228480 (2006-10-01), Lin
patent: 2008/0166554 (2008-07-01), Husemann et al.
patent: 0578979 (1994-01-01), None
patent: 02090317 (2002-11-01), None
patent: 2005063909 (2005-07-01), None
patent: 2007012656 (2007-02-01), None

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