Semiconductor device

Details Semiconductor device Semiconductor device

2009-09-18

2011-10-25

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S786000

Reexamination Certificate

active

08044522

ABSTRACT:
A semiconductor device includes a substrate; and a chip formed on the substrate and electrically connected to the substrate by a wire. The chip includes a wiring layer electrically connected to the wire; and a protective layer formed on the wiring layer. The wiring layer includes a wiring portion having the protective layer formed in an upper layer thereof and being electrically connected to another layer at a lower layer thereof; a bonding portion connected to one end of the wire at an exposed surface thereof, the exposed surface not having the protective layer formed in an upper layer thereof; and a connecting portion configured to join the wiring portion and the bonding portion. The connecting portion includes an etched portion formed by digging out the wiring layer.

REFERENCES:
patent: 6727590 (2004-04-01), Izumitani et al.
patent: 2003/0151149 (2003-08-01), Ichikawa
patent: 2008/0128826 (2008-06-01), Fukamizu et al.
patent: 2010/0159690 (2010-06-01), Kasaoka et al.
patent: 2010/0320600 (2010-12-01), Pratt
patent: 3-227540 (1991-10-01), None
patent: 2005-223172 (2005-08-01), None

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