Method of forming piezoelectric resin film

Details Method of forming piezoelectric resin film Method of forming piezoelectric resin film

2007-06-29

2011-11-01

Turocy, David (Department: 1712)

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

C528S310000, C528S332000, C528S335000, C528S336000, C528S347000

Reexamination Certificate

active

08048493

ABSTRACT:
An objective is to provide a method of forming a piezoelectric resin film produced at low cost, and specifically to provide the method in which a large-area piezoelectric resin film is produced at low cost, and at reduced investment in facilities. Disclosed is a method of forming a piezoelectric resin film possessing the steps of polymerizing a monomer at a temperature of 5-60° C. to obtain a resin having a polymerization degree of 4-300, and a polarity group possessing one bond selected from a urea bond, an ester bond, an amide bond and an imide bond, coating the resin onto a substrate; and further polymerizing the resin at 70-250° C. while conducting a poling treatment.

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