Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2009-04-24
2011-10-04
Pelham, Joseph M (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S399000, C118S724000
Reexamination Certificate
active
08030599
ABSTRACT:
Provided are a substrate processing apparatus, a heating device, and a semiconductor device manufacturing method. The substrate processing apparatus comprises a process chamber configured to process a substrate. A heating element is installed at a peripheral side of the process chamber. An annular inner wall is installed at a peripheral side of the heating element. An annular outer wall is installed at a peripheral side of the inner wall with a space being formed therebetween. An annular cooling member is installed at the space for cooling. An actuating mechanism moves the cooling member between a contacting position where the cooling member makes contact with at least one of the inner wall and the outer wall and a non-contacting position where the cooling member does not make contact with any one of the inner wall and the outer wall. A control unit controls at least the actuating mechanism.
REFERENCES:
patent: 6547922 (2003-04-01), Hori et al.
patent: 6858087 (2005-02-01), Hori et al.
patent: 2002/0005171 (2002-01-01), Hori et al.
patent: 2003/0136517 (2003-07-01), Hori et al.
patent: 2009/0064935 (2009-03-01), Dauelsberg et al.
patent: 2010/0273320 (2010-10-01), Kappeler et al.
patent: 8-69977 (1996-03-01), None
patent: 8-195351 (1996-07-01), None
patent: 3112672 (2000-09-01), None
patent: 2004-311648 (2004-11-01), None
Brundidge & Stanger, P.C.
Hitachi Kokusai Electric Inc.
Pelham Joseph M
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