LED package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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Details

C257SE33056, C257SE33061, C257SE33067, C257SE33075

Reexamination Certificate

active

08053799

ABSTRACT:
The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.

REFERENCES:
patent: 6943433 (2005-09-01), Kamada
patent: 7612385 (2009-11-01), Kim et al.
patent: 7821020 (2010-10-01), Park
patent: 2002/0021085 (2002-02-01), Ng
patent: 2002/0163006 (2002-11-01), Yoganandan et al.
patent: 2004/0065894 (2004-04-01), Hashimoto et al.
patent: 2004/0256706 (2004-12-01), Nakashima
patent: 2006/0103012 (2006-05-01), Chin
patent: 2006/0157686 (2006-07-01), Jang et al.
patent: 2006-093626 (2006-04-01), None
patent: 2006-135276 (2006-05-01), None
patent: 10-2004-0093384 (2004-11-01), None
patent: 592508 (2006-06-01), None

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