Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate
2009-07-06
2011-10-11
Louie, Wai Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
With means to control surface effects
Insulating coating
C257S642000, C257S676000, C257S747000, C257SE25031
Reexamination Certificate
active
08035202
ABSTRACT:
A semiconductor chip of the present invention has a wiring substrate and a chip part. The wiring substrate has an insulating resin layer having a first major surface and a second major surface, and a first wiring layer disposed on the insulating resin layer on the second major surface side. The chip part has a projection electrode on the bottom surface. The insulating resin layer holds the chip part such that the bottom and side surfaces of the chip part are in contact with the insulating resin layer, and the top surface of the chip part is exposed on the insulating layer on the first major surface side. The projection electrode of the chip part is connected with the first wiring layer.
REFERENCES:
patent: 6791199 (2004-09-01), Sakamoto et al.
patent: 2001/0053598 (2001-12-01), Koyama
patent: 2002/0135057 (2002-09-01), Kurita
patent: 2003/0101584 (2003-06-01), Matsumura
patent: 2003/0116347 (2003-06-01), Kubo et al.
patent: 2004/0155322 (2004-08-01), Cho et al.
patent: 2006/0234420 (2006-10-01), Yokozuka et al.
patent: 1235699 (1999-11-01), None
patent: 2-165073 (1990-06-01), None
patent: 4-82241 (1992-03-01), None
patent: 11-251368 (1999-09-01), None
patent: 2000-151057 (2000-05-01), None
patent: 2000-156386 (2000-06-01), None
patent: 2000-223602 (2000-08-01), None
patent: 2000-299427 (2000-10-01), None
patent: 2000286297 (2000-10-01), None
patent: 2000-315705 (2000-11-01), None
patent: 2001-7156 (2001-01-01), None
patent: 2002-368155 (2002-12-01), None
patent: 2003-8167 (2003-01-01), None
patent: 2004-311788 (2004-11-01), None
patent: WO 98/20542 (1998-05-01), None
Japanese Patent Office issued a Japanese Office Action dated Apr. 8, 2009, Application No. 2005-514495.
Watanabe Shinji
Yamaguchi Yukio
Louie Wai Sing
NEC Corporation
Young & Thompson
LandOfFree
Electronic device having a wiring substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device having a wiring substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device having a wiring substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4284745