Electronic device having a wiring substrate

Details Electronic device having a wiring substrate Electronic device having a wiring substrate

2009-07-06

2011-10-11

Louie, Wai Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S642000, C257S676000, C257S747000, C257SE25031

Reexamination Certificate

active

08035202

ABSTRACT:
A semiconductor chip of the present invention has a wiring substrate and a chip part. The wiring substrate has an insulating resin layer having a first major surface and a second major surface, and a first wiring layer disposed on the insulating resin layer on the second major surface side. The chip part has a projection electrode on the bottom surface. The insulating resin layer holds the chip part such that the bottom and side surfaces of the chip part are in contact with the insulating resin layer, and the top surface of the chip part is exposed on the insulating layer on the first major surface side. The projection electrode of the chip part is connected with the first wiring layer.

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Japanese Patent Office issued a Japanese Office Action dated Apr. 8, 2009, Application No. 2005-514495.

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