Lead frame with solder flow control

Details Lead frame with solder flow control Lead frame with solder flow control

2008-03-24

2011-11-01

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C029S827000, C257S666000, C257S779000, C361S813000

Reexamination Certificate

active

08050048

ABSTRACT:
A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding.

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