Wiring board and method of manufacturing the same

Details Wiring board and method of manufacturing the same Wiring board and method of manufacturing the same

2008-04-29

2011-10-25

Nguyen, Hoa C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C174S265000, C361S795000

Reexamination Certificate

active

08044306

ABSTRACT:
A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.

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European Search Report issued Jun. 20, 2011 in EP 07790573.5.

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