Flexible circuit with cover layer

Details Flexible circuit with cover layer Flexible circuit with cover layer

2007-04-13

2011-11-01

Lam, Cathy (Department: 1784)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S258000, C174S259000, C428S209000, C428S458000, C428S473500, C361S749000, C361S750000, C361S751000

Reexamination Certificate

active

08049112

ABSTRACT:
The invention relates to flexible circuits and more particularly to flexible printed circuits having cover layers. The cover layers may be a chemically-etchable adhesive polyimide. The cover layers may be patterned after they are applied to the flexible circuit substrate.

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U.S. Appl. No. 11/288,914 entitled “Polymer Etchant and Method of Using Same”; Guoping Mao, Rui Yang, Lizhang Yang, filed Nov. 28, 2005.
“The Technology of Photoresist Stripping”, Rudy Sedlak, RD Chemical Company, updated Dec. 9, 1999, [retrieved from the Internet on Feb. 20, 2007], URL <www.pcbfab.com/strppng.html>.
Product Literature: Holders Technology UK Ltd., “Espanex™ Adhesiveless Polyimide Laminate and Coverlay”, Mar. 2005, 4 pgs.

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