Device mounting board and semiconductor apparatus using the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S734000, C257SE21502

Reexamination Certificate

active

08039948

ABSTRACT:
A device mounting board for a device to be mounted on, comprising: a substrate; and a laminated film composed of a plurality of insulating layers formed on one side of the substrate. Here, any of the second and subsequent insulating layers from the substrate is a photosolder resist layer containing a cardo type polymer. The photosolder resist layer has a thickness smaller than that of the insulating resin film arranged between the photosolder resist layer and the substrate.

REFERENCES:
patent: 6323435 (2001-11-01), Strandberg et al.
patent: 2003/0173676 (2003-09-01), Horikawa
patent: 2003/0213616 (2003-11-01), Kusukawa et al.
patent: 1444269 (2003-09-01), None
patent: 1461181 (2003-12-01), None
patent: 2000-44776 (2000-02-01), None
patent: 2002-84074 (2002-03-01), None
patent: 2002-094247 (2002-03-01), None
patent: 2002-521852 (2002-07-01), None
patent: 2002-268584 (2002-09-01), None
patent: 2003-133469 (2003-09-01), None
patent: 2003-298234 (2003-10-01), None
patent: WO 01/73510 (2001-10-01), None

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