Formation of photoconductive and photovoltaic films

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

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Details

C118S7230AN, C118S666000, C118S663000, C204S298010, C156S345430, C156S345440

Reexamination Certificate

active

08061299

ABSTRACT:
A deposition system includes a vacuum reaction chamber with a substrate holder positioned in it. The substrate holder is for carrying a substrate therein. A sputtering apparatus is also positioned in the vacuum reaction chamber. The sputtering apparatus is configured to direct sputtered material towards the substrate to form a sputtered material region thereon. A plasma enhanced chemical vapor deposition (PECVD) apparatus is positioned in the vacuum reaction chamber. The PECVD apparatus is configured to deposit a PECVD material region thereon the substrate. The first PECVD apparatus includes a first PECVD electrode movable from a first position towards the substrate and a second position away from the substrate.

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