On-chip radio frequency shield with interconnect metallization

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Reexamination Certificate

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Reexamination Certificate

active

08063469

ABSTRACT:
Structure and method for fabricating a system on chip with an on-chip RF shield including interconnect metallization is described. In one embodiment, the system on chip includes an RF circuitry disposed on a first portion of a top surface of a substrate, and a semiconductor circuitry disposed on a second portion of the top surface of the substrate. An interconnect RF barrier is disposed between the RF circuitry and the semiconductor circuitry, the interconnect RF barrier coupled to a ground potential node.

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