Adhesive tape for electronic components

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S3550RA, C428S3550EP, C428S3550BL, C428S3550CN

Reexamination Certificate

active

08057894

ABSTRACT:
An adhesive tape for attaching and fixing electronic components has an adhesive layer on at least one surface of a heat-resistant film. The surface hardness of the adhesive layer is about more than 25 MPa, and the surface hardness of the adhesive layer is about more than 80 MPa after thermosetting at 200° C. for about one hour.

REFERENCES:
patent: 3687894 (1972-08-01), Collings et al.
patent: 4289843 (1981-09-01), Boutle et al.
patent: 4473674 (1984-09-01), Stoakley et al.
patent: 4578315 (1986-03-01), Santorelli
patent: 5019617 (1991-05-01), Kaidoo et al.
patent: 5160783 (1992-11-01), Nemoto et al.
patent: 5683806 (1997-11-01), Sakumoto et al.
patent: 6048576 (2000-04-01), Hwail et al.
patent: 6303219 (2001-10-01), Sawamura et al.
patent: 6777079 (2004-08-01), Zhiming
patent: 7247683 (2007-07-01), Hurley et al.
patent: 2003/0190466 (2003-10-01), Nakaba et al.
patent: 2004/0230000 (2004-11-01), Misumi et al.
patent: 2006/0089465 (2006-04-01), Kim et al.
patent: 2006/0106166 (2006-05-01), Inada et al.
patent: 2008/0226884 (2008-09-01), Sim et al.
patent: 2009/0011166 (2009-01-01), Kim et al.
patent: S60-196956 (1985-10-01), None
patent: S60-223139 (1985-11-01), None
patent: S61-211016 (1986-09-01), None
patent: S62-040183 (1987-02-01), None
patent: S62-141082 (1987-06-01), None
patent: H07-157739 (1995-06-01), None
patent: 10-1998-0068284 (1998-12-01), None
patent: 10-2001-0052801 (2000-06-01), None
patent: 10-2000-0048223 (2000-07-01), None
patent: 10-2002-0009144 (2002-02-01), None
patent: 10-2002-0075426 (2002-10-01), None
patent: 10-2003-0038147 (2003-05-01), None
patent: 10-2003-0093247 (2003-12-01), None
patent: 10-2004-0009616 (2004-01-01), None
patent: 10-2004-0084712 (2004-10-01), None
patent: 10-2005-0044259 (2005-05-01), None
patent: 10-2006-0045432 (2006-05-01), None
patent: WO 95/20820 (1995-08-01), None
Chemical Formula of Cresol Novolac epoxy resin. Available at http://www.hexionchem.co.kr/product/images/pro—01—28.gif, last accessed on Dec. 1, 2006.
“Heat sensitive adhesive in film form, prodn.—by rolling a mix. of liquid and solid nitrile rubbers, phenolic resin powder and additives”, Derwent Abstract of JP 48066140, Sep. 11, 1973.
E. W. Meijer, “A Model Study for Coatings Containing Hexamethoxymethylmelamine”, Journal of Polymer Science: Part A: Polymer Chemistry, vol. 24, 2199-2208, 1986.
Phthalic Anhydride, Hawley's Condensed Chemical Dictionary, 14th Edition, 2002.
Fred. W. Billmeyer, Jr., Textbook of Polymer Science, 3rd edition, John Wiley and Sons, Inc., pp. 437-438, 1984.
“Acrylonitrile-Butadiene Rubber (NBR)”, available at http://www.iisrp.com/WebPolymers/07NBR-18Feb2002.pdf, last accessed Dec. 18, 2009.
“Bismaleimides” by HOS Technik, available at http://www.hos-tec.com/index.php?option=com—content&task=view&id=7&Itemid=9, last visited on Sep. 2, 2010.
Office Action, dated Dec. 19, 2007 issued in U.S. Appl. No. 11/107,894.
Office Action, dated Apr. 17, 2008 issued in U.S. Appl. No. 11/107,894.
Office Action, dated Apr. 15, 2010 issued in U.S. Appl. No. 12/190,241.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Adhesive tape for electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive tape for electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive tape for electronic components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4279095

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.