Phenolic OH-containing polyimide silicone, epoxy resin and...

Details Phenolic OH-containing polyimide silicone, epoxy resin and... Phenolic OH-containing polyimide silicone, epoxy resin and...

2009-08-26

2011-11-08

Sellers, Robert (Department: 1765)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S107000, C525S109000, C525S111000, C525S113000, C525S114000

Reexamination Certificate

active

08053533

ABSTRACT:
A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25° C. and is free of a solvent.

REFERENCES:
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Japanese Patent No. 2005-113059, Sugao et al., Apr. 28, 2005, translation, 27 pages.

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