Resin-encapsulated semiconductor device and its...

Details Resin-encapsulated semiconductor device and its... Resin-encapsulated semiconductor device and its...

2008-01-24

2011-10-18

Tran, Tan N (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

C257S672000, C257S676000, C257SE23037

Reexamination Certificate

active

08039934

ABSTRACT:
A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device comprises a semiconductor chip including a silicon substrate, a die pad to which the semiconductor chip is secured through a first solder layer, a resin-encapsulating layer encapsulating the semiconductor chip, and lead terminals electrically connected to the semiconductor chip and including inner lead portion covered with the resin-encapsulating layer. The lead terminals are made of copper or a copper alloy. The die pad is made of 42 alloy or a cover alloy and has a thickness (about 0.125 mm) less than the thickness (about 0.15 mm) of the lead terminals.

REFERENCES:
patent: 62-136059 (1987-06-01), None
patent: 07-058273 (1995-03-01), None
patent: 08-162590 (1996-06-01), None
patent: 10-335540 (1998-12-01), None
patent: 11-260990 (1999-09-01), None
patent: 2006-302963 (2006-11-01), None

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