Semiconductor device having a semiconductor chip, and method...

Details Semiconductor device having a semiconductor chip, and method... Semiconductor device having a semiconductor chip, and method...

2010-08-09

2011-11-22

Nguyen, Thinh T (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S124000, C438S126000, C257S778000, C257S795000, C257SE21599

Reexamination Certificate

active

08062928

ABSTRACT:
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer having a UV B-stageable material. The UV B-stageable material is applied on the active surface of the semiconductor wafer.

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