Module with a built-in component, and electronic device with...

Details Module with a built-in component, and electronic device with... Module with a built-in component, and electronic device with...

2005-01-27

2011-11-22

Bui, Hung S (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S784000

Reexamination Certificate

active

08064213

ABSTRACT:
A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component100includes an insulating sheet substrate10which has an upper surface10a, a lower surface10bopposed to the upper surface10band a side surface10cwhich connects these surfaces. At least one wiring20extends from the upper surface to the lower surface through the side surface, and an electronic component32is disposed within the sheet substrate.

REFERENCES:
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 5235131 (1993-08-01), Mueller et al.
patent: 5835988 (1998-11-01), Ishii
patent: 5962917 (1999-10-01), Moriyama
patent: 5973395 (1999-10-01), Suzuki et al.
patent: 6232142 (2001-05-01), Yasukawa
patent: 6433418 (2002-08-01), Fujisawa et al.
patent: 6528353 (2003-03-01), Suh et al.
patent: 6646335 (2003-11-01), Emoto
patent: 6770981 (2004-08-01), Jiang et al.
patent: 7042717 (2006-05-01), El-Batal et al.
patent: 7639513 (2009-12-01), Otsuki
patent: 2004/0151882 (2004-08-01), Tani et al.
patent: 2004/0156177 (2004-08-01), Higashitani
patent: 2005/0040508 (2005-02-01), Lee
patent: 1198009 (1998-11-01), None
patent: 0 847 088 (1998-06-01), None
patent: 0 867 939 (1998-09-01), None
patent: 0 920 058 (1999-06-01), None
patent: 61-34963 (1986-02-01), None
patent: 11-195729 (1999-07-01), None
patent: 11-220262 (1999-08-01), None
patent: 2000-312060 (2000-11-01), None
patent: 2002-231755 (2002-08-01), None
patent: 2004-146856 (2004-05-01), None
Office Action in CN Patent Application No. 200510004772.3 of Oct. 26, 2007 (translation).

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