Integrated-circuit package for proximity communication

Details Integrated-circuit package for proximity communication Integrated-circuit package for proximity communication

2011-01-13

2011-10-18

Wagner, Jenny L. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S455000, C257SE23180

Reexamination Certificate

active

08039308

ABSTRACT:
Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die.

REFERENCES:
patent: 5804875 (1998-09-01), Remsburg
patent: 6495396 (2002-12-01), Drost
patent: 2006/0017150 (2006-01-01), Zingher
patent: 2007/0075442 (2007-04-01), Krishnamoorthy
patent: 1443559 (2004-08-01), None
patent: 1650801 (2005-09-01), None
patent: 2006050446 (2006-05-01), None

Affiliated with

Also associated with

Rating

Integrated-circuit package for proximity communication does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated-circuit package for proximity communication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated-circuit package for proximity communication will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4275311