Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2009-11-18
2011-10-11
Sefer, Ahmed (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S783000, C257SE23010, C257SE23116
Reexamination Certificate
active
08035212
ABSTRACT:
According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.
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Notice of Reason for Rejection mailed by Japan Patent Office on Feb. 16, 2010 in the corresponding Japanese patent application No. 2009-098267.
Final Notice of Reason for Rejection mailed by Japan Patent Office on May 25, 2010 in the corresponding Japanese patent application No. 2009-098267.
Explanation of Non-English Language References.
Happoya Akihiko
Takizawa Minoru
Tanaka Akira
Tanimoto Mitsuyoshi
Kabushiki Kaisha Toshiba
Knobbe Martens Olson & Bear LLP
Sefer Ahmed
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