Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-05
2011-11-22
Semenenko, Yuriy (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S252000
Reexamination Certificate
active
08064217
ABSTRACT:
A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.
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Cho Han-Seo
Cho Suk-Hyeon
Kim Byung-Moon
Yoo Je-Gwang
Samsung Electro-Mechanics Co. Ltd.
Samsung LED Co., Ltd.
Semenenko Yuriy
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