Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-10-13
2011-10-18
Chen, Xiaoliang (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S729000, C361S760000, C361S764000, C361S783000, C361S790000, C257S678000, C257S686000, C257S723000, C439S059000, C439S060000, C439S062000, C439S079000, C439S330000
Reexamination Certificate
active
08040682
ABSTRACT:
A semiconductor device comprises: a plurality of semiconductor chip; a socket; and a mounting board equipped with the socket. Each of the semiconductor chips has a major surface, a back surface and a plurality of connection terminals on the major surface. The socket has internal connection terminals inside and external connection terminals outside, and the internal connection terminals are in contact with the connection terminals of the semiconductor chips.
REFERENCES:
patent: 4405929 (1983-09-01), Sugano
patent: 4616895 (1986-10-01), Yoshizaki et al.
patent: 4864116 (1989-09-01), Banjo et al.
patent: 5103247 (1992-04-01), Sugano et al.
patent: 5208729 (1993-05-01), Cipolla et al.
patent: 5227664 (1993-07-01), Toshio et al.
patent: 5980267 (1999-11-01), Ayers et al.
patent: 5995378 (1999-11-01), Farnworth et al.
patent: 6007357 (1999-12-01), Perino et al.
patent: 6094057 (2000-07-01), Hiruta et al.
patent: 6222739 (2001-04-01), Bhakta et al.
patent: 6392897 (2002-05-01), Nakase et al.
patent: 6472744 (2002-10-01), Sato et al.
patent: 6713854 (2004-03-01), Kledzik et al.
patent: 6757751 (2004-06-01), Gene
patent: 6882241 (2005-04-01), Abo et al.
patent: 6898085 (2005-05-01), Haba et al.
patent: 6954082 (2005-10-01), Grillettc
patent: 6976848 (2005-12-01), Choi
patent: 7005878 (2006-02-01), Cobbley et al.
patent: 7055757 (2006-06-01), Nishizawa et al.
patent: 7085872 (2006-08-01), Liaw et al.
patent: 7126219 (2006-10-01), Hsieh et al.
patent: 7132841 (2006-11-01), Bertin et al.
patent: 7161820 (2007-01-01), Funaba et al.
patent: 7170314 (2007-01-01), Haba et al.
patent: 7227759 (2007-06-01), Grundy et al.
patent: 7414312 (2008-08-01), Nguyen et al.
patent: 2004/0159938 (2004-08-01), Hedler et al.
patent: 2006/0049500 (2006-03-01), Goodwin
patent: 2007/0020964 (2007-01-01), Tzu
patent: 11-067985 (1999-03-01), None
Banner & Witcoff , Ltd.
Chen Xiaoliang
Kabushiki Kaisha Toshiba
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