Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-07-09
2011-11-08
Banks, Derris (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S835000, C257S758000, C257S753000
Reexamination Certificate
active
08051557
ABSTRACT:
The invention provides a substrate with multi-layer interconnection structure, which includes a substrate and a multi-layer interconnection structure formed on the substrate. The multi-layer interconnection structure is adhered to the substrate in partial areas. The invention also provides a method of manufacturing and recycling such substrate and a method of packaging electronic devices by using such substrate. The invention also provides a method of manufacturing multi-layer interconnection devices.
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Banks Derris
Carley Jeffrey T
Princo Corp.
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