Method for mounting electronic component on substrate and...

Details Method for mounting electronic component on substrate and... Method for mounting electronic component on substrate and...

2007-10-25

2011-11-01

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C228S180210, C438S613000

Reexamination Certificate

active

08046911

ABSTRACT:
A method for mounting an electronic component on a substrate includes: forming an Au bump (24) on a surface of an electrode (20) of a substrate (10); placing an Sn-based solder sheet (26) on the Au bump; subjecting the Sn-based solder sheet and the Au bump to reflow soldering, to thus form an Au—Sn eutectic alloy (28); smoothing the eutectic alloy; and bonding an electronic component (30) on a surface of the smoothed eutectic alloy.

REFERENCES:
patent: 6153940 (2000-11-01), Zakel et al.
patent: 6424037 (2002-07-01), Ho et al.
patent: 6902098 (2005-06-01), Dautartas
patent: 2006-035310 (2006-02-01), None

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