Multi-layer wiring board and method of manufacturing the same

Details Multi-layer wiring board and method of manufacturing the same Multi-layer wiring board and method of manufacturing the same

2009-03-27

2011-10-11

Nguyen, Hoa C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S259000, C174S262000, C361S767000, C361S760000

Reexamination Certificate

active

08035035

ABSTRACT:
A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a solder resist which covers the rear surface and which has solder resist openings formed at positions corresponding to the second terminals; a reinforcing plate which is made of a non-metal material and which has reinforcing plate openings formed at positions corresponding to the second terminals; and an adhesive layer interposed between the solder resist and the reinforcing plate to fix the reinforcing plate to the solder resist and which includes adhesive layer openings formed at positions corresponding to the second terminals. A diameter of the solder resist openings and a diameter of the reinforcing plate openings are smaller than that of the adhesive layer openings.

REFERENCES:
patent: 6084781 (2000-07-01), Klein
patent: 6576493 (2003-06-01), Lin et al.
patent: 6988312 (2006-01-01), Nakamura et al.
patent: 7345246 (2008-03-01), Muramatsu et al.
patent: 7435680 (2008-10-01), Nakamura et al.
patent: 2006/0272853 (2006-12-01), Muramatsu et al.
patent: 2007/0076392 (2007-04-01), Urashima et al.

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