Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2007-08-17
2011-12-06
Deo, Duy (Department: 1713)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C438S006000, C438S007000, C438S008000, C438S009000, C438S706000
Reexamination Certificate
active
08071397
ABSTRACT:
A semiconductor fabricating method including: placing the semiconductor wafer having a film thereon inside of a chamber; generating plasma; detecting a quantity of interference lights for each of at least two wavelengths obtained from a surface of the wafer for a predetermined time period during the etching of the wafer; detecting a first time point at which the detected quantity of interference lights for one of the two wavelengths becomes a maximum and a second time point at which the detected quantity of interference lights for the other wavelength becomes a minimum; determining a state of etching based on a result of comparing a predetermined value with an interval between the first and second time points, wherein both time points are detected by using outputs of a detector for detecting a quantity of the interference lights; and controlling etching in accordance with the determining.
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Jyouo Kazuhiro
Ono Tetsuo
Usui Tatehito
Yoshigai Motohiko
Antonelli, Terry Stout & Kraus, LLP.
Deo Duy
Hitachi High-Technologies Corporation
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