Reliable interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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Details

C257SE23002, C257S660000, C438S118000, C438S622000

Reexamination Certificate

active

08035201

ABSTRACT:
Embodiments relate to a method for forming reliable interconnects by the use of a device layer that can serve as a barrier or an etch stop layer, among other applications. The device layer is UV resistant in that its dielectric constant and stress remain stable or relatively stable when subjected to UV curing.

REFERENCES:
patent: 7253125 (2007-08-01), Bandyopadhyay et al.
patent: 7482265 (2009-01-01), Chen et al.
patent: 7851232 (2010-12-01), van Schravendijk et al.

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