Substrate including wiring for transmitting signal,...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S760000, C361S762000, C361S795000, C174S255000, C174S260000, C174S264000, C257S691000, C257S774000

Reexamination Certificate

active

08072774

ABSTRACT:
An apparatus includes a substrate which includes an electronic component mounted on the substrate, the electronic component for processing a pair of signals, the substrate including a first wire for transmitting one of the signals, the first wire being formed on a first layer of the substrate, and a second wire for transmitting another one of the signals, the second wire being formed on a second layer of the substrate in a first region under the electronic component and being formed on a third layer in a second region of an other part of the first region.

REFERENCES:
patent: 5898217 (1999-04-01), Johnston
patent: 6008534 (1999-12-01), Fulcher
patent: 6198635 (2001-03-01), Shenoy et al.
patent: 6512181 (2003-01-01), Okubo et al.
patent: 6762367 (2004-07-01), Audet et al.
patent: 7084512 (2006-08-01), Higashida et al.
patent: 7149022 (2006-12-01), Mun et al.
patent: 7205668 (2007-04-01), Wu et al.
patent: 7404250 (2008-07-01), Cheng et al.
patent: 2004/0050585 (2004-03-01), Audet et al.
patent: 4-255287 (1992-09-01), None
patent: 2001-53507 (2001-02-01), None
patent: 2002-57467 (2002-02-01), None

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