Semiconductor device with lead structure within the planar area

Details Semiconductor device with lead structure within the planar area Semiconductor device with lead structure within the planar area

1992-12-14

1996-12-10

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257696, 257686, 257787, 257706, H01L 2348

Patent

active

055833756

ABSTRACT:
A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.

REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4989069 (1991-01-01), Hawkins
patent: 5266834 (1993-11-01), Nishi et al.

Affiliated with

Also associated with

Rating

Semiconductor device with lead structure within the planar area does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with lead structure within the planar area , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with lead structure within the planar area will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-425861