Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate
2011-05-10
2011-12-27
Patel, Tulsidas C (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate
active
08083529
ABSTRACT:
A socket includes a first relay board mounted on a mounting board, a second relay board detachably mounted on the first relay board, and a frame part fixed to the first relay board. The frame part positions and holds the first and second relay boards, and positions detachably and holds an object of connection on the second relay board. The first relay board includes first and second conductor layers on its first and second surfaces, respectively. The second conductor layer is electrically connected to the mounting board. The second relay board includes third and fourth conductor layers on its first and second surfaces, respectively; and first and second connection terminals with a spring characteristic on the third and fourth conductor layers, respectively. The first and second connection terminals contact the object of connection and the first conductor layer, respectively, to electrically connect the object of connection and the mounting board.
REFERENCES:
patent: 3788337 (1974-01-01), Breer
patent: 6478585 (2002-11-01), Yuasa et al.
patent: 7110246 (2006-09-01), Tsunooka et al.
patent: 7264486 (2007-09-01), Ma
patent: 2002/0028591 (2002-03-01), Yuasa et al.
patent: 2007/0155196 (2007-07-01), Cheng et al.
IPUSA, PLLC
Nguyen Phuongchi
Patel Tulsidas C
Shinko Electric Industries Co. Ltd.
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