Heat dissipation in computing device

Details Heat dissipation in computing device Heat dissipation in computing device

2010-10-26

2011-11-01

Datskovskiy, Michail V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679520, C361S679540, C361S679550, C361S690000, C361S700000, C361S714000, C165S080300, C165S080400, C165S080500, C165S104210, C165S104260, C165S104330, C165S104340

Reexamination Certificate

active

08050028

ABSTRACT:
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

REFERENCES:
patent: 4015808 (1977-04-01), Carroll
patent: 4713714 (1987-12-01), Gatti et al.
patent: 4896777 (1990-01-01), Lewis
patent: 4937806 (1990-06-01), Babson et al.
patent: 5002368 (1991-03-01), Anglin
patent: 5004207 (1991-04-01), Ishikawa et al.
patent: 5084855 (1992-01-01), Kobayashi et al.
patent: 5156371 (1992-10-01), Samarov
patent: 5164542 (1992-11-01), Hart
patent: 5237486 (1993-08-01), LaPointe et al.
patent: 5309983 (1994-05-01), Bailey
patent: 5339214 (1994-08-01), Nelson
patent: 5402308 (1995-03-01), Koyanagi et al.
patent: 5406451 (1995-04-01), Korinsky
patent: 5486942 (1996-01-01), Ichikawa et al.
patent: 5568357 (1996-10-01), Kochis et al.
patent: 5568360 (1996-10-01), Penniman et al.
patent: 5598320 (1997-01-01), Toedtman et al.
patent: 5654875 (1997-08-01), Lawson
patent: 5659376 (1997-08-01), Uehara et al.
patent: 5673176 (1997-09-01), Penniman et al.
patent: 5687059 (1997-11-01), Hoppal
patent: 5712762 (1998-01-01), Webb
patent: 5715139 (1998-02-01), Nakajima
patent: 5784256 (1998-07-01), Nakamura et al.
patent: 5793920 (1998-08-01), Wilkins et al.
patent: 5801922 (1998-09-01), Shen et al.
patent: 5818693 (1998-10-01), Garner et al.
patent: 5822187 (1998-10-01), Garner et al.
patent: 5829515 (1998-11-01), Jeffries et al.
patent: 5831816 (1998-11-01), Johns et al.
patent: 5838400 (1998-11-01), Ueda et al.
patent: 5964279 (1999-10-01), Mochizuki et al.
patent: 5966286 (1999-10-01), O'Connor et al.
patent: 5973920 (1999-10-01), Altic et al.
patent: 5995365 (1999-11-01), Broder et al.
patent: 6002588 (1999-12-01), Vos et al.
patent: 6005768 (1999-12-01), Jo
patent: 6038129 (2000-03-01), Falaki et al.
patent: 6049453 (2000-04-01), Hulsebosch
patent: 6061231 (2000-05-01), Crockett
patent: 6072664 (2000-06-01), Aoyagi et al.
patent: 6088223 (2000-07-01), Diemunsch
patent: 6094343 (2000-07-01), Nakagawa et al.
patent: 6104611 (2000-08-01), Glover et al.
patent: 6122164 (2000-09-01), Liao et al.
patent: 6122167 (2000-09-01), Smith et al.
patent: 6125035 (2000-09-01), Hood, III et al.
patent: 6144552 (2000-11-01), Whitcher et al.
patent: 6151207 (2000-11-01), Kim
patent: 6157538 (2000-12-01), Ali et al.
patent: 6178084 (2001-01-01), Shibasaki
patent: 6205025 (2001-03-01), Chen
patent: 6208506 (2001-03-01), Pao
patent: 6209631 (2001-04-01), Garcia-Ortiz
patent: 6289678 (2001-09-01), Pandolfi
patent: 6320744 (2001-11-01), Sullivan et al.
patent: 6324054 (2001-11-01), Chee et al.
patent: 6347035 (2002-02-01), Hamano et al.
patent: 6366463 (2002-04-01), Hamano
patent: 6392876 (2002-05-01), Ramonowski
patent: 6392880 (2002-05-01), Forlenza et al.
patent: 6404627 (2002-06-01), Tanaka et al.
patent: 6418017 (2002-07-01), Patel et al.
patent: 6424338 (2002-07-01), Anderson
patent: 6434000 (2002-08-01), Pandolfi
patent: 6456491 (2002-09-01), Flannery et al.
patent: 6487073 (2002-11-01), McCullough et al.
patent: 6498722 (2002-12-01), Stolz et al.
patent: 6509981 (2003-01-01), Shih
patent: 6532152 (2003-03-01), White et al.
patent: 6542359 (2003-04-01), Babcock et al.
patent: 6549414 (2003-04-01), Tokuhara et al.
patent: 6567265 (2003-05-01), Yamamura et al.
patent: 6587339 (2003-07-01), Daniels et al.
patent: 6606132 (2003-08-01), Giannatto
patent: 6628521 (2003-09-01), Gustine et al.
patent: 6665180 (2003-12-01), Lehman et al.
patent: 6682180 (2004-01-01), Sakamoto et al.
patent: 6717799 (2004-04-01), Hamano et al.
patent: 6717816 (2004-04-01), Tanaka et al.
patent: 6781830 (2004-08-01), Barth et al.
patent: 6795310 (2004-09-01), Ghosh
patent: 6900984 (2005-05-01), Merz et al.
patent: 7019967 (2006-03-01), DiFonzo et al.
patent: 7031761 (2006-04-01), Hunt et al.
patent: 7075789 (2006-07-01), Gustine et al.
patent: 7301761 (2007-11-01), Merz et al.
patent: 7457111 (2008-11-01), Merz et al.
patent: 7633757 (2009-12-01), Gustine et al.
patent: 7835147 (2010-11-01), Merz et al.
patent: 2002/0043608 (2002-04-01), Nakata et al.
patent: 2002/0051338 (2002-05-01), Jiang et al.
patent: 2003/0210516 (2003-11-01), Bernett et al.
patent: 2005/0286229 (2005-12-01), Ku
patent: 2007/0263355 (2007-11-01), Yu et al.
patent: 2009/0213537 (2009-08-01), Heesen
patent: 411143585 (1999-05-01), None
Panasonic “Toughbook 28” www.panasonic.com/computer
otebook/html/01a—s8.htm, Nov. 2, 2001.

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